Silicon Photonic Products

 

Silicon photonic transmitter and receiver dies as well as advanced die-stack assemblies for next-generation optical engines.
Designed for optical transceiver vendors and system manufacturers requiring highly integrated, scalable optical solutions.

Available in multiple channel configurations, data rates, and optical interface standards, including the options shown below.

 

TRX-1.6T-DR8

  • Dual-die silicon photonic transmitter and receiver chipset
  • 8 channels (4 per die) supporting 106.25 / 113.4375 GBd PAM4
  • Bare-die silicon for direct PCB bonding with copper pillars (150 µm pitch)
  • Designed for 800GbE and 1.6TbE optical transceivers


RX-800G-DR4

  • 4 channels RX supporting 106.25 / 113.4375 GBd PAM4
  • Die-stacked linear transimpedance amplifier (TIA) enabling high signal integrity and high-speed operation
  • Integrated high-speed SiGe photodiode (HSPD) with high responsivity
  • Integrated Variable Optical Attenuator (VOA) for overload protection and improved receiver sensitivity
  • Integrated monitoring and control functions including RSSI, LOS/LOM indicators, configurable gain and peaking, temperature sensor, and I²C diagnostic interface


RX-1.6T-DR4

RX die-stack
  • 4 channels RX supporting 400G per lane
  • Die-stacked linear transimpedance amplifier (TIA) enabling high signal integrity and high-speed operation
  • Integrated high-speed SiGe photodiode (HSPD) with high responsivity
  • Integrated Variable Optical Attenuator (VOA) for overload protection and improved receiver sensitivity
  • Integrated monitoring and control functions including RSSI, LOS/LOM indicators, configurable gain and peaking, temperature sensor, and I²C diagnostic interface