Co-developing Photonics and Electronics

Sicoya develops highly integrated transmitter and receiver chips as well as stacked electronic-photonic assemblies for next-generation optical engines and produces them in mature Silicon Photonics foundries. When combining high-speed analog electronics with advanced photonic architectures through scalable die-stacking technologies, Sicoya enables compact and mass-producible optical sub-assemblies for high-bandwidth optical transceivers.

This architecture reduces electrical interconnect lengths, improves signal integrity, and enables higher bandwidth density and power efficiency compared to conventional optical module implementations. The result is scalable optical engine solutions optimized for high-volume manufacturing and next-generation data center interconnects.