Hyperscale and AI datacenters require optical interconnects that combine extremely high data rates with scalable, cost-efficient manufacturing. Optical links inside and between datacenters must support hundreds of gigabits per second per connection over distances of several kilometers.
Sicoya develops high-performance silicon photonic dies and optical engines for next-generation transceivers. By combining advanced silicon photonics with innovative die-stacking of electronic components such as TIAs, Sicoya achieves a high level of integration that enables compact, high-performance optical engines while simplifying transceiver design and manufacturing.
Publications
The scientific findings from our many years of technology development have already been published in numerous journal and conference articles. With regard to the many research grants and collaborations we are happy to share these results with the public and thus be able to give an insight into this exciting topic.